APPLE HARDWARE DATABASE (2023-2026)

EN: Specifications CN: 规格参数汇总 JP: 仕様書一覧 FR: Spécifications ES: Especificaciones DE: Spezifikationen
YEAR 2026 - [IPHONE 18 SERIES & NEXT-GEN]
iPhone 18 Pro / 18 Ultra (2nm Node)
Display/显示/画面:6.3" (Pro) / 6.9" (Ultra) - Under-display Face ID (隐藏式面容)
Chipset/芯片/チップ:A20 Pro (TSMC 2nm Process / 2nm プロセス)
Memory/内存/メモリ:12GB / 16GB LPDDR6 (For LLM/AI Processing)
Camera/相机/カメラ:48MP Main + 48MP Periscope (Variable Aperture / 可变光圈)
Power/电池/電池:4200-5100 mAh; 40W Wired; 20W MagSafe Qi2
iPhone 18 (Standard/Plus)
Display/尺寸:6.3" (18) / 6.7" (18 Plus) - 120Hz ProMotion
Chipset/处理器:A20 Bionic (2nm)
YEAR 2025 - [IPHONE 17 SERIES & M5]
iPhone 17 (Standard / Base Model)
Display/显示:6.3-inch LTPO OLED (Upgrade from 6.1")
Refresh/刷新率:120Hz ProMotion (Standard models now feature ProMotion)
Chipset/芯片:A19 Bionic (3nm N3P Process)
RAM/内存:8GB (Support Apple Intelligence)
iPhone 17 Slim (Air Edition)
Display/尺寸:6.6-inch Ultra-Slim Chassis (5.5mm - 6.0mm)
Design/设计:Aluminum-Titanium Alloy; Single 48MP Rear Cam
iPhone 17 Pro / Pro Max
Display/画面:6.3" (Pro) / 6.9" (Pro Max)
RAM/内存:12GB RAM (Minimum for Pro Series)
Cam/相机:Triple 48MP Array; 24MP Front Cam upgrade
YEAR 2024 - [IPHONE 16 SERIES & M4]
iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max
Size/尺寸:6.1", 6.7" (Base) | 6.3", 6.9" (Pro)
Features/特性:Capture Button (Camera Control); A18/A18 Pro Chips
iPad Pro M4:11" & 13" Tandem OLED (World's thinnest 5.1mm)
YEAR 2023 - [IPHONE 15 SERIES]
iPhone 15 / Plus / Pro / Pro Max
Size/尺寸:6.1", 6.7" (All models)
Interface/接口:USB-C (Transition from Lightning)
Material/材质:Titanium Grade 5 (Pro Models only)
MACBOOK & IPAD (2023-2026)
MacBook Pro M6:2026 Early - 2nm Chip, OLED Panel (14"/16")
MacBook Pro M4/M5:2024/25 - M4 Max / M5 Max, Up to 128GB RAM
iPad Pro M5:2025 Late - M5 Chip, Apple Intelligence 2.0
MacBook Air M3:2024 March - 13"/15" M3, Base 16GB RAM upgrade